| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in photosensitivity to active energy rays, enabling formation of a fine pattern, giving a cured film having excellent developability, insulating property, heat resistance, folding resistance or the like, and suitably used for a photosolder resist.SOLUTION: The photosensitive resin composition comprises: a photosensitive resin (A); at least one kind of curing agent (B) selected from an epoxy group-containing compound, a non-blocked isocyanate compound and a blocked isocyanate compound; a photopolymerization initiator (C); and a carboxybenzotriazole derivative (D). The photosensitive resin (A) is a hydroxyl group-containing photosensitive resin (A-1) obtained through steps of reacting an epoxy compound (a) having at least two epoxy groups in one molecule with a phenolic curing agent (B) having at least two phenolic hydroxyl groups in one molecule to produce a side-chain hydroxyl group-containing resin (c), reacting the side-chain hydroxyl group-containing resin (c) with a polybasic acid anhydride (d) to produce a carboxyl group-containing resin (e), and reacting the carboxyl group-containing resin (e) with an epoxy group or an oxetane group in a compound (f) having an epoxy group or an oxetane group and having an ethylenically unsaturated group; or a carboxyl group-containing photosensitive resin (A-2) produced by reacting the hydroxyl group in the above hydroxyl group-containing resin (A-1) with an acid anhydride group of the polybasic acid anhydride (d). |
