| 摘要 |
PURPOSE: An eddy current sensor, a grinding method, and a grinding device are provided to inspect the existence of residues of metal film or a conductive film on a substrate in a grinding process by using the eddy current sensor, thereby reducing time for inspection. CONSTITUTION: An eddy current sensor is arranged near a wafer in which a metal film or a conductive film is formed and detects eddy currents formed on the metal film or the conductive film. A conducting wire or a plurality of coils (63A, 63B), which have different size and are coiled around a conductor, are separately arranged so that the outer coil covers the inner coil. Each of the coils separately detects the eddy current formed on the metal film or the conductive film. [Reference numerals] (10T) Fifth row second floor; (AA,CC) Floor; (BB,DD) Row |
