ELONGATED BUMPS IN INTEGRATED CIRCUIT DEVICES

摘要

PURPOSE: Elongated bumps in integrated circuit devices are provided to minimize stress in a low-k dielectric layer by optimizing the size of a bump structure. CONSTITUTION: A passivation layer (42) covers the edges of a metal pad (40). The passivation layer includes a first opening part which overlaps with the metal pad. A polymer layer (46) is located on the passivation layer. The polymer layer includes a second opening part which overlaps with the metal pad. A UBM (48) includes a first part which is located in the second opening part and a second part which is located on a part of the polymer layer.