发明名称 METHOD FOR REDUCING MAPPING OF ELECTRODEPOSITED COATING LAYER
摘要 FIELD: metallurgy.SUBSTANCE: coating includes two layers. The first coating layer is deposited from the first coating composition containing the following: (i) compound of metal of group IIIB, compound of metal of group IVB or their combination. The second coating layer is deposited from the second coating composition containing the following: (a) resin with reactive functional groups, which contains ionic saline group with active hydrogen, (b) linking agent showing reaction activity in relation to at least one of reactive functional resin groups, and (c) soluble alkali-earth metal that is contained in the quantity of not more than 1000 p/mln in terms of total weight of the second coating composition.EFFECT: invention allows reducing mapping of a coating layer applied to a substrate.21 cl, 4 ex
申请公布号 RU2495162(C2) 申请公布日期 2013.10.10
申请号 RU20120101246 申请日期 2010.06.15
申请人 PPG INDASTRIZ OGAJO, INK. 发明人 KAJLO ALAN DZH.;BOJD DONAL'D V.;GRANT GEHRRI R.
分类号 C25D13/20 主分类号 C25D13/20
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