发明名称 Three dimensional memory structure
摘要 The Configurable Vertical Integration [CVI] invention pertains to methods and apparatus for the enhancement of yields of 3D or stacked integrated circuits and herein referred to as a CVI Integrated Circuit [CVI IC]. The CVI methods require no testing of circuit layer components prior to their fabrication as part of a 3D integrated circuit. The CVI invention uses active circuitry to configure the CVI IC as a means to isolate or prevent the use of defective circuitry. CVI circuit configuration method can be predominately described as a large grain method.
申请公布号 US2013265067(A1) 申请公布日期 2013.10.10
申请号 US201313800803 申请日期 2013.03.13
申请人 LEEDY GLENN J 发明人 LEEDY GLENN J
分类号 G01R31/28 主分类号 G01R31/28
代理机构 代理人
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