PANEL CUTTING DEVICE AND PANEL CUTTING METHOD USING THE SAME

摘要

PURPOSE: An apparatus for dividing a substrate and a method for dividing the substrate using the same are provided to scribe and divide the substrate without damage such as scratches on the surface of the substrate. CONSTITUTION: An apparatus for dividing a substrate includes a first conveyor (100), a second conveyor (120), a scribe unit (140), and a substrate gripping unit (160). The first and the second conveyor are arranged on an installation table at a certain distance in a first direction which is a substrate conveying direction. The scribe unit is placed between the first and the second conveyor. The substrate gripping unit at the first conveyor of the installation table grips at least one edge of the substrate on the first conveyor when the substrate is scribed. The scribe unit moves to the first direction and a second direction opposite to the first direction. [Reference numerals] (AA) Substrate inlet side; (BB) Substrate outlet side