CERAMIC CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME, AND SEMICONDUCTOR MODULE

摘要

PROBLEM TO BE SOLVED: To provide a circuit board that has a configuration in which both of a metal substrate having copper as a main component and a metal substrate having aluminum as a main component are joined to a ceramic substrate, and has high reliability.SOLUTION: A metal circuit board 12 and a heat sink 13 are joined with each other by causing thin wax material paste to be subjected to a heat treatment while interposing the thin wax material paste between a ceramic substrate 11 and the metal circuit board 12 and the heat sink 13 so as to form joint layers 14 (first joint layer 141 and second joint layer 142) in which the wax material paste is solidified. The wax material paste contains as a metal composition silver particles containing 0.2 to 5.0 wt.% of titanium hydride (TiH) particles having the average particle diameter (d50) of 0.1 to 20 μm, and has the average particle diameter (d50) of 10 to 5000 nm.