| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiation structure of an electronic apparatus which achieves the downsizing of the heat radiation structure and the cost reduction and improves heat radiation effects of the electronic apparatus in a state that an electronic component forming the electronic apparatus is electrically insulated from a heat radiation member.SOLUTION: In a heat radiation structure 10 of an electronic apparatus 14 where an intermediate member 48 is provided between a transistor 18 serving as an electronic component forming the electronic apparatus 14 and a heat radiation housing 42, the intermediate member 48 includes: an insulator film 44 provided at the heat radiation housing 42; and a conductive film 46 disposed between the insulation film 44 and the transistor 18 and achieving heat radiation performance. The insulation film 44 is made of aluminium oxide and the conductive film 46 is made of graphite. |
