| 摘要 |
Provided is a wafer rotation apparatus capable of rotating a wafer inside a processing tank without generating very fine waste, in order to eliminate processing irregularities on the wafer. The present invention has: a processing solution tank (2) accommodating a processing solution and allowing a wafer to be immersed in the processing solution; a wafer holder (6) for holding the lower middle portion of the wafer (W) inside the processing solution tank (2), the wafer holder (6) configured so as to be able to swing in a direction along the surface of the wafer; and a set of wafer guides (7) positioned so as to sandwich the wafer holder (6) inside the processing solution tank (2) and configured so as to be able to hold the lower middle portion of the wafer by moving vertically relative to the wafer holder (6), the wafer holder (6) being caused to swing with the wafer (W) being held by the wafer guides (7), after which the wafer holder (6) and the wafer guides (7) are caused to move vertically relative to each other to return the wafer (W) to the wafer holder (6), whereby the support portion of the wafer (W) on the wafer holder (6) is altered in order to cause the wafer to rotate. |
