发明名称 |
Radiation imaging device |
摘要 |
Wiring substrates 11 and 12 are positioned on a fixed base 10 in a manner such that there is a step between the wiring substrates, and radiation imaging elements 2 and 3, respectively having scintillators 25 and 35 deposited on photosensitive portions 21 and 31, are respectively mounted on the wiring substrates 11 and 12. The radiation imaging element 2 is positioned so that its setting surface protrudes beyond a radiation incident surface of the radiation imaging element 3, and the photosensitive portion 21 of the radiation imaging element 2 and the photosensitive portion 31 of the radiation imaging element 3 are juxtaposed to a degree to which the portions do not overlap. The photosensitive portion 21 of the radiation imaging element 2 extends close to an edge at the radiation imaging element 3 side and the scintillator 25 of substantially uniform thickness is formed up to this position. |
申请公布号 |
EP2103958(A3) |
申请公布日期 |
2013.10.09 |
申请号 |
EP20090007290 |
申请日期 |
2005.05.10 |
申请人 |
HAMAMATSU PHOTONICS K.K. |
发明人 |
MORI, HARUMICHI;HONDA, MASAHIKO;KYUSHIMA, RYUJI;FUJITA, KAZUKI |
分类号 |
G01T1/20;A61B6/00;H01L27/14;H01L27/146;H01L31/0203;H01L31/0232;H01L31/09;H04N5/32;H04N5/321 |
主分类号 |
G01T1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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