摘要 |
System for limiting motion of a sensor assembly, in particular due to shocks. Stud bumps (110, 122) may be bonded to the base substrate (120), to the support ring (114), to the floating pad (50) or to the stop ring (52). The tud bumps create a shock cage between the spring-mounted pad (50) configured to receive the sensor device and the base substrate (120) or the stop ring (114). |