发明名称 |
Mounting structure of electronic component |
摘要 |
A mounting structure of an electronic component includes: a bump electrode included in the electronic component, the bump electrode having an internal resin as a core and a conductive film covering a surface of the internal resin, and elastically deforming so as to follow a shape of at least one corner of a terminal so that the conductive film makes direct conductive contact with at least part of a top surface of the terminal and at least part of a surface along a thickness direction of the terminal; a substrate having the terminal and the electronic component that is mounted on the substrate; and a holding unit provided to the substrate and the electronic component so as to hold a state in which the bump electrode electrically deformed makes conductive contact with the terminal.
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申请公布号 |
US8552310(B2) |
申请公布日期 |
2013.10.08 |
申请号 |
US201213346087 |
申请日期 |
2012.01.09 |
申请人 |
HASHIMOTO NOBUAKI;SEIKO EPSON CORPORATION |
发明人 |
HASHIMOTO NOBUAKI |
分类号 |
H05K1/11;H05K1/02;H05K1/14;H05K1/16;H05K7/12 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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