| 摘要 |
PURPOSE: A bonded sheet, an electronic component and a method for manufacturing the same are provided to have the excellent solder-melting and bond strength, and to also simply solder-bond. CONSTITUTION: A bonded sheet includes a solder layer (3) and a thermosetting resin layer (4). The solder layer contains a thermosetting resin, solder particles, and an activator that activates the solder particles. A thermosetting resin containing layer is laminated at least on one side of the thickness direction of the solder layer, and contains the thermosetting resin. The thermosetting resin containing layer further contains the thermosetting resin. The containing ratio of the thermosetting resin to the thermosetting resin containing layer is 10 vol% to 47.5 vol%. |
