发明名称 |
Method of cutting an object to be processed |
摘要 |
A method of cutting an object which can accurately cut the object is provided. An object to be processed 1 such as a silicon wafer is irradiated with laser light L while a light-converging point P is positioned therewithin, so as to form a modified region 7 due to multiphoton absorption within the object 1, and cause the modified region 7 to form a starting point region for cutting 8 shifted from the center line CL of the thickness of the object 1 toward the front face 3 of the object 1 along a line along which the object should be cut. Subsequently, the object 1 is pressed from the rear face 21 side thereof. This can generate a fracture from the starting point region for cutting 8 acting as a start point, thereby accurately cutting the object 1 along the line along which the object should be cut.
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申请公布号 |
US8551865(B2) |
申请公布日期 |
2013.10.08 |
申请号 |
US201213451988 |
申请日期 |
2012.04.20 |
申请人 |
FUKUYO FUMITSUGU;FUKUMITSU KENSHI;HAMAMATSU PHOTONICS K.K. |
发明人 |
FUKUYO FUMITSUGU;FUKUMITSU KENSHI |
分类号 |
H01L21/301;B23K26/38;B23K26/40;B28D1/22;B28D5/00;C03B33/02;C03B33/033;C03B33/07 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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