| 发明名称 |
Method of making circuit board module |
| 摘要 |
A circuit board module includes a circuit board and a heat-dissipating device. The circuit board includes a ceramic substrate, and a circuit pattern formed on a surface of the ceramic substrate. The circuit board is sinter-bonded to a main body of the heat-dissipating device. A method of making the circuit board module is also disclosed.
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| 申请公布号 |
US8549739(B2) |
申请公布日期 |
2013.10.08 |
| 申请号 |
US20100800414 |
申请日期 |
2010.05.13 |
| 申请人 |
CHIANG WEN-CHUNG;WU KENG-CHUNG;HSIEH YING-CHI;LU CHENG-KANG;FU MING-HUANG;TONG HSING ELECTRONIC INDUSTRIES, LTD. |
发明人 |
CHIANG WEN-CHUNG;WU KENG-CHUNG;HSIEH YING-CHI;LU CHENG-KANG;FU MING-HUANG |
| 分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
| 代理机构 |
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