LED PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A light emitting diode package and a manufacturing method thereof are provided to reduce an operating voltage by simultaneously emitting light from six cells. CONSTITUTION: A plurality of LED cells are formed on a substrate. Two or more groups are composed of the LED cells. A p-type electrode (7) is formed on the upper surfaces of the LED cells. An n-type contact electrode (5) is formed on an n-type nitride semiconductor layer. Two p-type contact electrodes (10) are formed on an insulation layer. [Reference numerals] (1) Sapphire substrate; (10) p-type contact electrode; (11) Current pass; (2) n-type semiconductor; (3) 6 LED cell structures; (4) n-pad electrode; (5) n-type contact electrode; (6) p-type semiconductor; (7) p-electrode; (8) Insulation layer; (AA) Light emission