MANUFACTURING METHOD FOR NON-CONTACT ELEMENT

摘要

PURPOSE: A method for manufacturing a contactless device is provided to mount a control element via a penetration unit, to charge epoxy, and to bond wires, thereby reducing failure by preventing damage to a mounting element and the wires. CONSTITUTION: A method for manufacturing a contactless device includes the following steps of: press-processing a lead frame in which lead and an element mounting surface are formed at a predetermine form (S10); forming a lower element mold with a penetration unit on which the control element can be mounted (S20); mounting the formed lower element mold on the underside of the lead frame and mounting an upper element mold on the top surface of the lead frame (S30); mounting the control element via the penetration unit of the lower element mold and wire-bonding a gap between the control element and the lead (S40); charging epoxy for element protection inside the penetration unit of the lower element mold (S50); wire-bonding and joining a cover after charging epoxy inside the opening unit (S60); removing a lead supporting unit of the lead frame (S70); and completing the manufacture of the contactless device by bending the lead. [Reference numerals] (S10) Processing a lead frame; (S20) Forming a lower element mold; (S30) Mounting the formed lower element mold; (S40) Mounting the control element and wire-bonding; (S50) Charging epoxy; (S51) Mounting a lower cover; (S60) Mounting a detecting element; (S70) Removing a lead supporting unit; (S80) Bending a lead