发明名称 |
DEFECT DETECTION APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To suitably detect defects of wiring on a substrate.SOLUTION: An infrared camera 4 is attached to a beam section 12c of a gantry 12, the beam section being disposed across an alignment stage 11 having a mother board 1 placed thereon, such that the relative position with respect to the board surface of the mother board 1 placed on the alignment stage 11 is fixed in the direction perpendicular to the board surface. |
申请公布号 |
JP2013205234(A) |
申请公布日期 |
2013.10.07 |
申请号 |
JP20120074783 |
申请日期 |
2012.03.28 |
申请人 |
SHARP CORP |
发明人 |
UEDA YASUHIRO;SHINOZAKI TOSHIYUKI;MORITA HARUYUKI;KOKETSU HIDETO;NAKAKURA YUKIHIKO |
分类号 |
G01N25/72;G01B11/00;G01N21/956;G01N27/20;G01R31/02 |
主分类号 |
G01N25/72 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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