发明名称 DEFECT DETECTION APPARATUS
摘要 PROBLEM TO BE SOLVED: To suitably detect defects of wiring on a substrate.SOLUTION: An infrared camera 4 is attached to a beam section 12c of a gantry 12, the beam section being disposed across an alignment stage 11 having a mother board 1 placed thereon, such that the relative position with respect to the board surface of the mother board 1 placed on the alignment stage 11 is fixed in the direction perpendicular to the board surface.
申请公布号 JP2013205234(A) 申请公布日期 2013.10.07
申请号 JP20120074783 申请日期 2012.03.28
申请人 SHARP CORP 发明人 UEDA YASUHIRO;SHINOZAKI TOSHIYUKI;MORITA HARUYUKI;KOKETSU HIDETO;NAKAKURA YUKIHIKO
分类号 G01N25/72;G01B11/00;G01N21/956;G01N27/20;G01R31/02 主分类号 G01N25/72
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