发明名称 |
SEMICONDUCTOR CHIP DEVICE WITH UNDERFILL |
摘要 |
A method of manufacturing is provided that includes placing a removable cover on a surface of a substrate. The substrate includes a first semiconductor chip positioned on the surface. The first semiconductor chip includes a first sidewall. The removable cover includes a second sidewall positioned opposite the first sidewall. A first underfill is placed between the first semiconductor chip and the surface wherein the second sidewall provides a barrier to flow of the first underfill. Various apparatus are also disclosed. |
申请公布号 |
KR20130109116(A) |
申请公布日期 |
2013.10.07 |
申请号 |
KR20137007013 |
申请日期 |
2011.09.09 |
申请人 |
ADVANCED MICRO DEVICES, INC.;ATI TECHNOLOGIES ULC |
发明人 |
SU MICHAEL Z.;FU LEI;REFAI AHMED GAMAL;BLACK BRYAN |
分类号 |
H01L23/28;H01L23/12 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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