RESIN COMPOSITION FOR FILLING THE TEMPERATURE SENSOR

摘要

PURPOSE: A resin composition for filling a temperature sensor is provided to have excellent adhesion with inorganic and organic materials, high thermal impact resistance, and improved flexibility. CONSTITUTION: A resin composition for filling a temperature sensor comprises 100.0 parts by weight of an epoxy mixed resin and 15-40 parts by weight of a mixed hardener. The epoxy mixed resin comprises 30-50 weight% of an alkoxysilane-modified epoxy resin which has an alkoxysilane group represented by chemical formula 1; 15-25 wt% of a rubber-modified epoxy resin; and 34-45 wt% of alumina. The mixed curing agent comprises 20-30 wt% of a modified aliphatic amine and 70-80 wt% of polyoxypropylenediamine. In the chemical formula, R^1 is a C1-20 alkyl group; and R^2 is a C1-4 substituted group which has an organic functional group selected from a vinyl group, a glycidoxy group, an acryl group, and a mercapto groups.