发明名称 WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To suppress loss of a signal when adjustment of a characteristic impedance is performed.SOLUTION: A wiring board includes: a core layer 12 which has electrical conductivity and in which an opening 18 is selectively arranged; signal wiring 16 arranged in the opening 18; and an insulating layer 10 arranged on a main surface of the core layer 12. A distance T1 of the signal wiring 16 along the thickness direction of the core layer 12 is larger than a distance L1 of the signal wiring 16 in the surface direction of the core layer 12.
申请公布号 JP2013201244(A) 申请公布日期 2013.10.03
申请号 JP20120068196 申请日期 2012.03.23
申请人 TAIYO YUDEN CO LTD 发明人 NISHIMURA HIDENORI;TASAKA NAOYUKI;TANAKA SACHIKO
分类号 H05K1/02;H01L23/12 主分类号 H05K1/02
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