| 摘要 |
Provided are a semiconductor device that can ensure reliable contact between a plurality of semiconductor modules and cooling bodies and can be easily assembled, and a method for manufacturing the semiconductor device. The semiconductor device is provided with: semiconductor modules (2A-2D) that seal a circuit substrate mounted with at least one semiconductor chip with a molded resin seal and are pierced by installation holes (27), main terminal boards (3A-3C) separately connected between the individual connection terminals of the plurality of semiconductor modules arranged in parallel, and a module storage case (4) that accommodates and holds said plurality of semiconductor modules that are mutually connected by the main terminal boards, inserted from an opening member (51) unified with the main terminal board, and can undergo position adjustments when the semiconductor modules are installed; and has installation insertion holes (59) opposite each of the installation holes of each semiconductor module. |
