| 摘要 |
In a Line On Glass (LOG) type Liquid Crystal Display (LCD) device and a method of fabricating the same, LOGs and Outer Lead Bonding (OLB) lines are designed in a parallel structure, and a structure of contact holes within Flexible Printed Circuit (FPC) pads and bumpers of Integrated Circuits (ICs) changes, so as to prevent a broken fault due to corrosion and scratch, resulting in improvement of quality of an image displayed on the LCD device.
|
