| 摘要 |
A method of processing a wafer, includes processing a first type wafer and a second type wafer, inspecting the wafers, deriving a first relational expression from a parameter that depends on the type of wafer and from inspection results, the first relational expression relating the inspection results to the parameter, calculating a next processing condition for next wafer type to be processed from the first relational expression, processing a wafer under the next processing condition, inspecting the wafer, producing a second relational expression by correcting the first relational expression using reference points determined in accordance with the first relational expression and a point representing the inspection result of the wafer, and processing wafers under a processing condition calculated from the second relational expression.
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