| 摘要 |
PROBLEM TO BE SOLVED: To provide a one-component liquid epoxy resin which cures at 120°C or lower, and does not deteriorate bonding strength even after exposure at high temperature.SOLUTION: This epoxy resin composition includes (A) an epoxy resin, (B) a glycidylamine type multifunctional epoxy resin, (C) dicyandiamide, and (D) a latent hardener other than dicyandiamide, as essential components, where the blend ratio of (A) the epoxy resin and (B) the glycidylamine type multifunctional epoxy resin, in mass, is (A):(B)=80:20 to 0:100; and (B) the glycidylamine type multifunctional epoxy resin is a compound expressed by formula (1) and/or formula (2). |
