发明名称 Deformable Apparatus and Method
摘要 An apparatus and method wherein the apparatus comprises includes a deformable substrate; a conductive portion; and at least one support configured to couple the conductive portion to the deformable substrate so that the conductive portion is spaced from the deformable substrate.
申请公布号 US2013256004(A1) 申请公布日期 2013.10.03
申请号 US201213435372 申请日期 2012.03.30
申请人 COTTON DARRYL;HAQUE SAMIUL MD.;ANDREW PIERS;NOKIA CORPORATION 发明人 COTTON DARRYL;HAQUE SAMIUL MD.;ANDREW PIERS
分类号 H05K1/02;H05K3/10;H05K3/20;H05K3/24 主分类号 H05K1/02
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