HEATING DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR THIN FILM, AND SEMICONDUCTOR THIN FILM

摘要

PROBLEM TO BE SOLVED: To provide a heating device etc. which enables selective heating of an object and maximizes the airtightness of a furnace body.SOLUTION: A heating device includes: a furnace body 10; an induction heating coil placed in the furnace body 10; and a conductor part 32 that is inserted into an introduction port 15 formed at the furnace body 10 so as not to contact with an inner wall of the introduction port 15, the conductor part 32 to which high-frequency power supplied to the induction heating coil is input. In the introduction port 15 in which the conductor part 32 is inserted, at least a portion contacting with the conductor part 32 is hermetically sealed by a sealing member 33 having electrical insulation properties.