发明名称 |
A BIODEGRADABLE CIRCUIT BOARD |
摘要 |
<p>A circuit board (100) comprising a substrate (110), a first at least partly electrically conductive layer (120), and a second at least partly electrically conductive layer (130), wherein the second at least partly electrically conductive layer (130) is arranged a distance apart from the first at least partly electrically conductive layer (120). The substrate (110) comprises polylactide and lignin. An electronic device comprising the circuit board. A substrate material granule (510) for manufacturing a substrate for a circuit board. A method for manufacturing the substrate material granules. A method for manufacturing the circuit board. Use of the substrate material granule (510) for manufacturing a circuit board (100) or an electronic device.</p> |
申请公布号 |
WO2013144420(A1) |
申请公布日期 |
2013.10.03 |
申请号 |
WO2012FI50316 |
申请日期 |
2012.03.29 |
申请人 |
UPM-KYMMENE CORPORATION;LUUKKO, KARI;KAEHAERI, HANNA;FORS, STEFAN |
发明人 |
LUUKKO, KARI;KAEHAERI, HANNA;FORS, STEFAN |
分类号 |
C08L97/00;B29B9/10;C08L67/04;H01B3/42;H05K1/03 |
主分类号 |
C08L97/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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