发明名称 A BIODEGRADABLE CIRCUIT BOARD
摘要 <p>A circuit board (100) comprising a substrate (110), a first at least partly electrically conductive layer (120), and a second at least partly electrically conductive layer (130), wherein the second at least partly electrically conductive layer (130) is arranged a distance apart from the first at least partly electrically conductive layer (120). The substrate (110) comprises polylactide and lignin. An electronic device comprising the circuit board. A substrate material granule (510) for manufacturing a substrate for a circuit board. A method for manufacturing the substrate material granules. A method for manufacturing the circuit board. Use of the substrate material granule (510) for manufacturing a circuit board (100) or an electronic device.</p>
申请公布号 WO2013144420(A1) 申请公布日期 2013.10.03
申请号 WO2012FI50316 申请日期 2012.03.29
申请人 UPM-KYMMENE CORPORATION;LUUKKO, KARI;KAEHAERI, HANNA;FORS, STEFAN 发明人 LUUKKO, KARI;KAEHAERI, HANNA;FORS, STEFAN
分类号 C08L97/00;B29B9/10;C08L67/04;H01B3/42;H05K1/03 主分类号 C08L97/00
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