CONDUCTIVE PASTE FOR DIE BONDING, AND DIE BONDING METHOD USING CONDUCTIVE PASTE FOR DIE BONDING

摘要

The present invention is a conductive paste for die bonding, which is composed of a metal powder and an organic solvent. The metal powder is composed of one or more kinds of metal particles having a purity of 99.9% by mass and an average particle diameter of 0.01-1.0 mum and selected from among a silver powder, a palladium powder and a copper powder, and coating layers that cover at least parts of the metal particles and are formed of gold. The conductive paste of the present invention is capable of suppressing the occurrence of defects such as voids at a bonded portion when a semiconductor element or the like is die-bonded to a substrate.