摘要 |
Disclosed herein are methods of cleaning a lipseal and/or cup bottom of an electroplating device by removing metal deposits accumulated in prior electroplating operations. The methods may include orienting a nozzle such that it is pointed substantially at the inner circular edge of the lipseal and/or cup bottom, and dispensing a stream of cleaning solution from the nozzle such that the stream contacts the inner circular edge of the lipseal and/or cup bottom while they are being rotated, removing metal deposits. In some embodiments, the stream has a velocity component against the rotational direction of the lipseal and/or cup bottom. In some embodiments, the deposits may include a tin/silver alloy. Also disclosed herein are cleaning apparatuses for mounting in electroplating devices and for removing electroplated metal deposits from their lipseals and/or cup bottoms. In some embodiments, the cleaning apparatuses may include a jet nozzle. |
申请人 |
NOVELLUS SYSTEMS, INC.;KUMAR, SANTOSH;BUCKALEW, BRYAN, L.;MAYER, STEVEN, T.;PONNUSWAMY, THOMAS;HOSACK, CHAD, MICHAEL;RASH, ROBERT;CHUA, LEE, PENG;PORTER, DAVID |
发明人 |
KUMAR, SANTOSH;BUCKALEW, BRYAN, L.;MAYER, STEVEN, T.;PONNUSWAMY, THOMAS;HOSACK, CHAD, MICHAEL;RASH, ROBERT;CHUA, LEE, PENG;PORTER, DAVID |