发明名称 HEAT RELEASABLE ADHESIVE SHEET FOR CUTTING ELECTRONIC COMPONENT, AND METHOD FOR MACHINING ELECTRONIC COMPONENT
摘要 <p>A conventional energy beam curable heat releasable adhesive sheet does not have sufficient adhesion between the substrate and the cured energy beam curable elastic layer, and there are cases where partial peeling (anchor fracturing) occurs between the energy beam curable elastic layer and the substrate, and cases where adhesive remains on the adherent. In order to resolve these issues, provided is a heat releasable adhesive sheet having a heat releasable adhesive layer containing heat expanding microscopic spheres, the heat releasable adhesive layer being provided to one surface of a substrate, wherein an energy beam curable elastic layer is placed on the other surface with an organic coating layer interposed therebetween.</p>
申请公布号 WO2013146707(A1) 申请公布日期 2013.10.03
申请号 WO2013JP58637 申请日期 2013.03.25
申请人 NITTO DENKO CORPORATION 发明人 HIRAYAMA TAKAMASA;SHIMOKAWA DAISUKE;ARIMITSU YUKIO
分类号 C09J7/02;B32B27/00 主分类号 C09J7/02
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