UNIVERSAL INTERCONNECT FOOTPRINT FOR BONDING SEMICONDUCTOR SUBSTRATES

摘要

A side (43) of a first semiconductor substrate (15) is provided with a first set (60) of interconnect structures (45a, 45b). The first semiconductor substrate (15) is operable to have at least one of plural semiconductor substrates (20, 155, 160) stacked on the side (43). The first set (60) of interconnect structures (45a, 45b) is arranged in a pattern. Each of the plural semiconductor substrates (20, 155, 160) has a second set (62) of interconnect structures (55a, 55b) arranged in the pattern, one of the plural semiconductor substrates (155) has a smallest footprint of the plural semiconductor substrates (20, 155, 160). The pattern of the first and second sets (60, 62) of interconnect structures (45a, 45b, 55a, 55b) has a footprint smaller than the smallest footprint (x3, y3) of the plural semiconductor substrates (20, 155, 160). In this way, the first semiconductor substrate (15), implemented as an interposer or otherwise, has an interconnect set (60) with a universal footprint capable of matching up with different sized dice (20, 155, 160) fabricated with matching interconnect sets (62) that share that universal footprint. The second semiconductor substrate (20) has overhangs (65a, 65b) that are lateral to the interconnect sets (60, 62). To provide support for the overhangs (65a, 65b), support structures (70a, 70b, 70c, 70d) may be provided at the periphery of the semiconductor substrate (20) and beneath the overhangs (65a, 65b). Alternatively, a support frame (182) may be provided.