INTERCONNECT STRUCTURE AND METHOD FOR PRODUCING SAME

摘要

There is provided a three-dimensional interconnect structure for microelectronic devices and a method for producing such an interconnect structure. The method comprises a step wherein a backbone structure 100 is manufactured using an additive layer-wise manufacturing process 310. The backbone structure 100 comprises a three-dimensional cladding skeleton 104 and a support structure 101. The cladding skeleton comprises layered freeform skeleton parts 105 that will form the electric interconnections between the electric contacts of the interconnect structure after a conductive material 202 is applied on the backbone structure 100. The support structure 101 supports the layered freeform skeleton parts 105. Parts 306 of the support structure 101 may be removed to isolate and/or expose the electric interconnections 205. The cladding skeleton can be embedded by an insulating material 303 for providing a further support.