<p>PURPOSE: A substrate processing apparatus and a method thereof are provided to perform a uniform process on a substrate by making uniform the intensity of a standing wave. CONSTITUTION: A lower electrode (210) is located in the space of a process chamber. The lower electrode supports the substrate. An upper electrode (300) is formed in the upper part of the lower electrode and faces the lower electrode. A high frequency applying line has a contact point for applying high frequency power to the lower electrode. A modulator (600) asymmetrically provides a dielectric material to the lower part of the lower electrode around the center of the lower electrode.</p>
