发明名称
摘要 A 3-dimensional integrated circuit designing method includes forming a temporary layout region for an original integrated circuit on an XY plane, the plane being short in an X direction and long in a Y direction perpendicular to the X direction, dividing the temporary layout region into 2N (N is an integral number of not smaller than 2) or more subregions in the Y direction, configuring one block for every successive N subregions to prepare a plurality of blocks, and forming N layers of layout by alternately folding each of the blocks in the Y direction in units of one subregion to selectively set a kN-th (k is an integral number not less than 1) subregion and (kN+1)th subregion of each block to one of an uppermost layer and lowermost layer.
申请公布号 JP5305806(B2) 申请公布日期 2013.10.02
申请号 JP20080245972 申请日期 2008.09.25
申请人 发明人
分类号 H01L21/82;G06F17/50;H01L21/822;H01L27/04 主分类号 H01L21/82
代理机构 代理人
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