| 摘要 |
PURPOSE: An optical proximity illumination sensor is provided to improve EMI properties under an environment in which noise is strong by blocking internal elements by a conductive layer. CONSTITUTION: An optical proximity illumination sensor includes a first nonconductor plate (110), a second nonconductor plate (120), an IR LED (140), an ASIC chip (150), and an upper cap (130). The first nonconductor plate includes a vertical hole with a cut tip forming a conical lateral wall (114) of a first cavity (112) for mounting the IR LED chip. A copper foil layer and gold are coated on the lateral wall of the vertical hole. The second nonconductor plate forms a first cavity by being welded with the first conductor plate. A copper foil layer and gold are coated on the bottom surface of the first cavity and form a cylindrical reflecting mirror with the gold coating layer of the vertical lateral wall. The IR LED is embedded on the bottom surface of the first bottom surface of the first cavity formed by the first and second nonconductor plates and emits infrared rays when power is supplied. The ASIC chip is mounted on the first nonconductor plate and senses the proximity of object by receiving infrared rays simultaneously with driving the IR LED and sensing the illumination of ambient lights. |
