CHIP-ON-FILM PACKAGE HAVING IMPROVED HEAT DISSIPATION

摘要

PURPOSE: A chip-on-film package having improved heat dissipation is provided to reduce the generation of bad chips by reducing the temperature of a chip. CONSTITUTION: A circuit part (230) is located on one surface of an insulating layer. An IC chip is electrically connected to the circuit part. The IC chip is mounted on a chip mounting region. At least one dummy pattern part (240) corresponding to a via hole is located on the same layer. A metal patch part is located on a part of the dummy pattern part exposed by the via hole.