| 发明名称 |
Slurry for polishing and planarization method of insulating layer using the same |
| 摘要 |
A polishing slurry includes an abrasive, a dispersion agent, a polish accelerating agent and an adhesion inhibitor. The adhesion inhibitor includes a benzene compound combined with a carboxyl group. Methods of planarizing an insulating layer using the slurry are also provided.
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| 申请公布号 |
US8546261(B2) |
申请公布日期 |
2013.10.01 |
| 申请号 |
US201113034345 |
申请日期 |
2011.02.24 |
| 申请人 |
KIM SANGKYUN;KIM NAMSOO;KIM JONGWOO;KIM YUN-JEONG;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM SANGKYUN;KIM NAMSOO;KIM JONGWOO;KIM YUN-JEONG |
| 分类号 |
H01L21/302 |
主分类号 |
H01L21/302 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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