发明名称 |
Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment |
摘要 |
A capacitor comprising: a capacitor body including a plurality of laminated dielectric layers, a plurality of inner electrode layers which are respectively disposed between mutually adjacent ones of the dielectric layers, a first main surface located in a laminated direction of the dielectric layers, and a second main surface opposite to the first main surface; a first outer electrode formed on the first main surface of the capacitor body and electrically connected to the inner electrode layers; a second outer electrode formed on the second main surface of the capacitor body and electrically connected to the inner electrode layers; a first dummy electrode formed on the first main surface of the capacitor body; and a second dummy electrode formed on the second main surface of the capacitor body.
|
申请公布号 |
US8546700(B2) |
申请公布日期 |
2013.10.01 |
申请号 |
US201113042686 |
申请日期 |
2011.03.08 |
申请人 |
YAMAMOTO HIROSHI;SEKI TOSHITAKE;YURI SHINJI;MURAMATSU MASAKI;SATO MOTOHIKO;HAYASHI KAZUHIRO;OTSUKA JUN;SATO MANABU;NGK SPARK PLUG CO., LTD. |
发明人 |
YAMAMOTO HIROSHI;SEKI TOSHITAKE;YURI SHINJI;MURAMATSU MASAKI;SATO MOTOHIKO;HAYASHI KAZUHIRO;OTSUKA JUN;SATO MANABU |
分类号 |
H05K1/16 |
主分类号 |
H05K1/16 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|