发明名称 Light emitting device and fabrication method thereof
摘要 A method of fabricating a vertical light emitting diode including: growing a low doped first semiconductor layer on a sacrificial substrate; forming an aluminum layer on the low doped first semiconductor; forming an AAO layer having a large number of holes formed therein by anodizing the aluminum layer; etching and patterning the low doped first semiconductor layer using the aluminum layer as a shadow mask, thereby forming grooves; removing the aluminum layer remaining; sequentially forming a high doped first semiconductor layer, an active layer and a second semiconductor layer on the low doped first semiconductor layer with the grooves; forming a metal reflective layer and a conductive substrate on the second semiconductor layer; separating the sacrificial substrate; and forming an electrode pad on the other surface of the low doped first semiconductor layer, the electrode pad filled in the grooves and in ohmic contact with the high doped first semiconductor.
申请公布号 US8546819(B2) 申请公布日期 2013.10.01
申请号 US201113235063 申请日期 2011.09.16
申请人 YOON YEO JIN;KIM CHANG YEON;SEOUL OPTO DEVICE CO., LTD. 发明人 YOON YEO JIN;KIM CHANG YEON
分类号 H01L27/15;H01L33/00;H01L33/22 主分类号 H01L27/15
代理机构 代理人
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