发明名称 METHOD OF MAKING SUSPENSION WITH CONDUCTION BRIDGE
摘要 PURPOSE: A method for manufacturing an integral suspension with a conductive bridge is provided to remove an unnecessary adhesion or assembly process, thereby improving the yield while reducing the manufacturing process time. CONSTITUTION: According to the properties of the product, a bridge pattern is designed (S1). A conductive bridge having the designed bridge pattern is manufactured (S2). The designed bridge pattern is formed by punching the periphery of a high-temperature-resistant planar sheet (S3). The periphery of the planar sheet and the conductive bridge are bonded to manufacture an integral suspension with the conductive bridge (S4,S5). A center dome is molded in the central part of the integral suspension (S6). [Reference numerals] (AA) Start; (BB) End; (S1) Design a bridge pattern; (S2) Manufacture a conductive bridge; (S3) Manufacture a bridge shape on a film; (S4) Bond a conductive bridge on the bridge shape on the film; (S5) Complete an integral suspension; (S6) Mold a center dome
申请公布号 KR101312924(B1) 申请公布日期 2013.10.01
申请号 KR20120146122 申请日期 2012.12.14
申请人 BSE CO., LTD.;RONGCHENG BAOXING ELECTRONIC CO., LTD.;DONGGUAN BAOXING ELECTRONICS CO., LTD.;TIANJIN BSE ELECTRONICS CO., LTD. 发明人 LEE, GYE SOO;OH, SE HWAN;LEE, JI HYUNG;IM, DONG WOOK
分类号 H04R31/00;H04R7/18 主分类号 H04R31/00
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