| 发明名称 |
SURFACE TREATMENT METHOD FOR COPPER WIRING AND METHOD FOR MANUFACTURING FUNCTIONAL ELEMENT TO BE MOUNTED ON COPPER WIRING |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a functional element whose characteristic variations are reduced by performing a cleaning treatment while securing flatness of a copper wiring surface at an opening formed on copper wiring.SOLUTION: A method for cleaning an exposed surface of copper wiring of a semiconductor substrate includes a cleaning step of removing an oxide film and/or organic matter on the exposed surface of the copper wiring while cooling the copper wiring. |
| 申请公布号 |
JP2013197451(A) |
申请公布日期 |
2013.09.30 |
| 申请号 |
JP20120065037 |
申请日期 |
2012.03.22 |
| 申请人 |
NEC CORP |
发明人 |
OKAMOTO KOICHIRO;TADA MUNEHIRO;HADA HIROMITSU |
| 分类号 |
H01L21/768;H01L21/3065;H01L21/3205;H01L21/82;H01L23/532;H01L27/105;H01L45/00;H01L49/00 |
主分类号 |
H01L21/768 |
| 代理机构 |
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代理人 |
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