| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state imaging device and a method of manufacturing the same, and a camera system, in which influence of leakage between two laminated substrates is prevented and influence on a measurement before shipment is suppressed.SOLUTION: In a solid-state imaging device, between an edge part and a scribe line region of at least first chip of a first and second chips in a laminated chip, a guard ring having conductivity is formed in an insulating film laminated on the first conductivity type substrate. On the first conductivity type substrate, at least two second conductivity type layers are formed with an interval in a region corresponding to the guard ring. The guard ring includes a first guard ring part connected to one of the second conductivity type layer on the chip edge part side, and a second guard ring part connected to the other second conductivity type layer on the scribe line side. |
