发明名称 |
IMAGE SENSOR AND FABRICATING METHOD THEREOF |
摘要 |
<p>PURPOSE: An image sensor and a manufacturing method thereof are provided to reduce resistance by forming a pad to correspond to a circuit. CONSTITUTION: A front surface and a rear surface are defined on a substrate (110). An insulation structure is formed on the front surface of the substrate. A contact hole exposes a circuit by passing through the substrate. A plurality of pads (151,152) are formed on the rear surface of the substrate. The pads are electrically connected to the circuit through the contact hole.</p> |
申请公布号 |
KR20130106619(A) |
申请公布日期 |
2013.09.30 |
申请号 |
KR20120028302 |
申请日期 |
2012.03.20 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, JIN HO;PARK, YOUNG HOON |
分类号 |
H01L27/146;H04N5/335 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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