发明名称 IMAGE SENSOR AND FABRICATING METHOD THEREOF
摘要 <p>PURPOSE: An image sensor and a manufacturing method thereof are provided to reduce resistance by forming a pad to correspond to a circuit. CONSTITUTION: A front surface and a rear surface are defined on a substrate (110). An insulation structure is formed on the front surface of the substrate. A contact hole exposes a circuit by passing through the substrate. A plurality of pads (151,152) are formed on the rear surface of the substrate. The pads are electrically connected to the circuit through the contact hole.</p>
申请公布号 KR20130106619(A) 申请公布日期 2013.09.30
申请号 KR20120028302 申请日期 2012.03.20
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, JIN HO;PARK, YOUNG HOON
分类号 H01L27/146;H04N5/335 主分类号 H01L27/146
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