| 摘要 |
PROBLEM TO BE SOLVED: To prevent a peelable metal foil of a multilayer substrate being a support substrate from being peeled due to a stress in a manufacturing process of a multilayer wiring board so as to improve a manufacturing yield of the multilayer wiring board.SOLUTION: A multilayer substrate includes a metal foil having a multilayer construction in which a plurality of metal layers are peelably laminated. A size of the metal foil of the multilayer construction is smaller than a size of the multilayer substrate. An inside face of the metal foil of the multilayer construction and an outside face of the metal foil of the multilayer construction are covered by an integrally formed insulation resin material. This multilayer substrate is used as a support substrate. |
