| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package having higher reliability by suppressing the problems of destruction of an interposer, cracking at the joint of the interposer to a package substrate, and the like, even if the interposer for semiconductor package is exposed to significant temperature change when mounting the interposer on the package substrate, or when using the semiconductor package.SOLUTION: Thermal stress generated due to the difference of coefficient of thermal expansion between an interposer and a package substrate is relaxed, even if the interposer is exposed to significant temperature change, by making the main surface of the interposer facing the package substrate concave. |
