| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering device and a soldering method for improving the quality of soldering by drag soldering in lands of different heat capacities.SOLUTION: A soldering device 1 includes: a soldering iron 15 for melting solder 15, moving it to a substrate 2 where a land 25 for ground and a land 24 for power supply are formed, supplying the melted solder 15 to the land 25 for the ground at a solder-for-ground supply position X2, and supplying the melted solder 15 to the land 24 for the power supply at a solder-for-power-supply supply position X1; a moving device for linearly moving the soldering iron 15 and changing the position of the soldering iron 15 to the solder-for-ground supply position X2 and the solder-for-power-supply supply position X1; and a controller for making a heat quantity to be imparted from the soldering iron 13 to the solder 15 when the position of the soldering iron 13 is the solder-for-ground supply position X2 be larger than a heat quantity to be imparted from the soldering iron 13 to the solder 15 when the position of the soldering iron 13 is the solder-for-power-supply supply position X1. |
