| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting conductive paste composition capable of reducing the specific resistance of an electrode, wire or the like to be formed and further minimizing the contact resistance thereof with another conductor.SOLUTION: A conductive paste composition contains, as thermosetting components, an epoxy resin (component A) having a cyclic structure which has an epoxy equivalent in the range of 160-400 and a viscosity (25°C) in the range of 3,000-55,000 mPa s; an epoxy resin (component B) having a cyclic structure, which has an epoxy equivalent in the range of 140-300 and a viscosity (25°C) in the range of 30-3,000 mPa s; and a solid resin (component C) obtained by polymerization using bisphenol and epichlorohydrin, these components being blended in a predetermined ratio. The ratio of conductive powders in the solid content is in the range of 90-98 mass%, and the composition has a paste viscosity (25°C) in the range of 200-500 Pa s. |
