METHOD FOR MANUFACTURING SUBSTRATE WITH INTEGRATED RADIATOR, AND SUBSTRATE WITH INTEGRATED RADIATOR

摘要

A metal circuit board (15) and a metal base plate (20) are bonded to a ceramic substrate (10) in order to form a metal-ceramic bonded substrate (2). Then, the metal base plate (20) is placed on top of one surface of a radiator (30) via a brazing filler material (33), a jig (51) that has a concave rounded surface (55) is butted against the other surface of the radiator (30), a jig (52) that has a convex rounded surface (56) protruding toward the metal-ceramic bonded substrate is brought into contact with the other surface of the metal circuit board (15), and the metal-ceramic bonded substrate (2) and the radiator (30) are thermally bonded together while applying a pressure by means of the radiator-side jig (51) and the metal-ceramic bonded substrate-side jig (52). The curvature radii (R (mm)) of the convex rounded surface (56) and the concave rounded surface (55) are expressed as 6,500 <= R <= surface pressure (N/mm2) × 2,000 + 12,000.