| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an optical semiconductor device capable of suppressing peeling of a sealing agent or a lens from an optical semiconductor device component formed of a resin material.SOLUTION: The present invention relates to a method of manufacturing an optical semiconductor device 1 equipped with: an optical semiconductor element 3; an optical semiconductor device component which is made from a resin material, and is a package 2 or a substrate; and a sealing agent 4 or a lens arranged to contact to the optical semiconductor device component. The method of manufacturing the optical semiconductor device 1 related to the present invention includes: a step in which, before the sealing agent 4 or the lens is arranged, a surface of the optical semiconductor device component formed of the resin material that contacts the sealing agent 4 or the lens is subjected to plasma processing; and a step in which, after the plasma processing, the sealing agent 4 is arranged so as to seal the optical semiconductor element 3 while contacting to the optical semiconductor device component, otherwise, the lens is arranged over the optical semiconductor element 3 so as to contact to the optical semiconductor device component. |
